Plasma Screen
This core process component, used inside ETCH reaction chambers in direct contact with the equipment's plasma, protects surfaces needing shielding from the exhaust gas flow around the wafer in a plasma environment.The surface requires a high corrosion resistance and high cleanliness ceramic coating for protection.
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Product Features
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Product Features
Utilizes overall high-purity yttrium-based coating
Anodization on inner wall enhances product lifespan
Utilizes plasma spraying technology for the high-purity yttrium-based coating.
The component, protected by a coating surface technology featuring extremely high chemical stability, resistance to acids/alkalis, voltage withstand, and plasma corrosion, can be in direct contact with plasma.
Coating material purity >99.95%
Breakdown voltage resistance >700V/mil, acid corrosion resistance >3h, adhesion strength >14MPa
