Chamber Shutter
This product is used inside ETCH reaction chambers, a core process component in direct contact with the equipment's plasma, providing protection for the sidewall surface at the wafer transfer entrance of the Liner in a plasma environment.
Consult an Expert
-
产品特点
-
Related Solutions
产品特点
Utilizes high purity yttrium-based coating on inner wall
Anodization on outer wall enhances product lifespan
Utilizes plasma spraying technology for the high-purity yttrium-based coating
The component, protected by a coating surface technology featuring extremely high chemical stability, resistance to acids/alkalis, voltage withstand, and plasma corrosion, can be in direct contact with plasma
Coating material purity >99.95%
Breakdown voltage resistance >700V/mil, acid corrosion resistance >3h, adhesion strength >14MPa
