Chamber Shutter
This product is used inside ETCH reaction chambers, a core process component in direct contact with the equipment's plasma, is used to transport wafers into the chamber for switching transmission. The surface requires a high corrosion resistance and high cleanliness ceramic coating for protection.
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Product Features
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Product Features
Utilizes high purity yttrium-based coating on inner wall
Anodization on outer wall enhances product lifespan
Utilizes plasma spraying technology for the high-purity yttrium-based coating
The component, protected by a coating surface technology featuring extremely high chemical stability, resistance to acids/alkalis, voltage withstand, and plasma corrosion, can be in direct contact with plasma
Coating material purity >99.95%
Breakdown voltage resistance >700V/mil, acid corrosion resistance >3h, adhesion strength >14MPa
