Pumping Plate
The PUMP plate is one of the key components, contributing to the stability improvement and energy consumption reduction of core processes like CVD. Gas uniformity directly impacts wafer process reactions.
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Product Characteristics
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Product Parameters
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Product Characteristics
High Precision
High precision equipment parts are fundamental for semiconductor chip manufacturing, especially at the nanometer scale.
Component precision directly determines the accuracy of wafer processing equipment and the implementation of its various process functions.
High Cleanliness
High-cleanliness equipment components are fundamental for achieving high yield rates in wafer processing.
The cleanliness of process equipment directly determines the yield rate of wafers in process and subsequent chips, even determining if an entire production line can produce qualified products.
Gas Flow Uniformity
High precision uniformity and stability of gas flow ensure process stability and processing quality, thereby improving the reliability and consistency of semiconductor products.
Product Parameters
| Material: | Aluminum Alloy |
| Connection Method: | Electron Beam Welding |
