Cathode Sleeve
This core process component, used inside ETCH reaction chambers in direct contact with the equipment's plasma, protects the outer wall of the cathode beneath the wafer during plasma etching.
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Product Features
Utilizes high purity yttrium-based coating on outer wall
Anodization on inner wall enhances product lifespan
Utilizes plasma spraying technology for the high-purity yttrium-based coating.
The component, protected by a coating surface technology featuring extremely high chemical stability, resistance to acids/alkalis, voltage withstand, and plasma corrosion, can be in direct contact with plasma.
Coating material purity >99.95%
Breakdown voltage resistance >700V/mil, acid corrosion resistance >3h, adhesion strength >14MPa
