Process Chamber Module
As a critical element of semiconductor equipment, the reaction chamber module's performance directly affects the stability and operational effectiveness of the system.
Certified by leading international clients for their overall performance, the company's reaction chamber modules find primary application in PVD, CVD, ALD, ETCH, RTP, and various other types of semiconductor equipment.
Consult an Expert
-
Product Characteristics
-
Product Parameters
-
Related Solutions
Product Characteristics
High Sealing Performance
Reliable sealing performance is critical to establishing and maintaining the equipment's vacuum environment, thereby providing a stable foundation for wafer processing reactions.
High Cleanliness
High-cleanliness equipment components are fundamental for achieving high yield rates in wafer processing. The cleanliness of process equipment directly determines the yield rate of wafers in process and subsequent chips, even determining if an entire production line can produce qualified products.
High Corrosion Resistant
A critical functional requirement for chip etching process equipment is the incorporation of highly corrosion-resistant components, as their corrosion resistance directly dictates the equipment's functionality, reliability, and the frequency of required maintenance interventions.
Product Parameters
| Composition: | Process Components, Structural Components, OEM Parts, Standard Parts |
| Leak Rate: | 1*10-9torr*l/s |
| Cleanliness: | Critical components undergo LPC (Liquid Particle Count) testing, ICP-MS metal element analysis, UV inspection. |
